Our tungsten copper heat base is to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices and also used in radio frequency, microwave, high power diode packaging and optical communication system.
With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits.
The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.