Cu-Mo-Cu Heat Base

Cu-Mo-Cu Heat Base Picture


Cu/Mo/Cu (CMC) is a sandwiched composite comprising a molybdenum core layer and two copper clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.Our products are widely used in applications such as optoelectronics packages, microwave packages, C packages etc.


Large size sheets available (length up to 400mm, width up to 200mm)

Can be stamped into components

Very strong interface bonding that can resist 850°C heat shock repeatedly

Adjustable CTE matching that of semiconductor and ceramic materials

High thermal conductivity

No magnetism

Technical date

Cu/Mo/Cu Density (g/c ) CTE Thermal Conductivity, W/m.k
(g/cm3) (ppm/k) In-Plane Thru-Thickness
13:74:13 9.88 5.6 200 170
1:4:1 9.75 6.0 220 180
1:3:1 9.66 6.8 244 190
1:2:1 9.54 7.8 260 210
1:1:1 9.32 8.8 305 250