Cu-Mo-Cu Heat Base
Introduction
Cu/Mo/Cu (CMC) is a sandwiched composite comprising a molybdenum core layer and two copper clad layers. It has adjustable CTE, high thermal conductivity, and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.Our products are widely used in applications such as optoelectronics packages, microwave packages, C packages etc.
Advantages
Large size sheets available (length up to 400mm, width up to 200mm)
Can be stamped into components
Very strong interface bonding that can resist 850°C heat shock repeatedly
Adjustable CTE matching that of semiconductor and ceramic materials
High thermal conductivity
No magnetism
Technical date
| Cu/Mo/Cu | Density (g/c ) | CTE | Thermal Conductivity, W/m.k | |
| （g/cm3） | (ppm/k) | In-Plane | Thru-Thickness | |
| 13:74:13 | 9.88 | 5.6 | 200 | 170 |
| 1:4:1 | 9.75 | 6.0 | 220 | 180 |
| 1:3:1 | 9.66 | 6.8 | 244 | 190 |
| 1:2:1 | 9.54 | 7.8 | 260 | 210 |
| 1:1:1 | 9.32 | 8.8 | 305 | 250 |
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