Propriétés de base de chaleur de cuivre de tungstène
Introduction
Tungsten copper heat base is fabricated from carefully controlled porous tungsten that is vacuum infiltrated with molten copper. This results in a WCu composite that has high conductivity and a matched low thermal expansion for heat bases.
It is a composite of tungsten and copper. By controlling the content of tungsten, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as ceramics (Al2O3, BeO), Semiconductors (Si), kovar, etc.
Advantages
High thermal conductivity,
Excellent electrical conductivity,
Excellent size control, surface finish and flatness,
Semi-finished or finished (Ni/Au plated) products available of properties of WCu and MoCu heat materials.
Matériau | W90Cu10 | W88Cu12 | W85Cu15 | W80Cu20 | W75Cu25 |
Teneur en tungstène (% en poids) | 90 ± 1 | 88 ± 1 | 85 ± 1 | 80 ± 1 | 75 ± 1 |
Densité à 20 ° C (g / cm3) | 17.0 | 16.8 | 16.3 | 15.6 | 14.9 |
Coefficient de dilatation thermique à 20 ° C (10-6 / K) | 6.5 | 6.7 | 7.0 | 8.3 | 9.0 |
Conductivité thermique à 25 ° C / 100 ° C (W / mK) | 180 - 190 | 185 - 195 | 190 - 200 | 200 - 210 | 220 - 230 |
Chaleur spécifique à 100 ° C (J / kgK) | 160 | 168 | 174 | 195 | 211 |
Résistance électrique spécifique à 20 ° C (μΩm) | 0.045 | 0.043 | 0.04 | 0.034 | 0.029 |
Dureté Vickers (HV 10) | 300 | 290 | 280 | 260 | 240 |